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CRM1206-FX-1004ELF - Bourns

Description: ■ Thick film technology ■ Power rating of 0.25, 0.5 or 1 watt at 70 °C ■ Low resistance value available ■ RoHS compliant*

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CRM1206-FX-1004ELF - Bourns - PCB symbol
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CRM1206-FX-1004ELF - Bourns PCB footprint - Resistor Chip - Resistor Chip - CRM1206-FX-1004ELF
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CRM1206-FX-1004ELF - Bourns - 3D model - Resistor Chip - CRM1206-FX-1004ELF
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CRM1206-FX-1004ELF Details

  • Manufacturer Part Number:

    CRM1206-FX-1004ELF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

CRM1206-FX-1004ELF Frequently Asked Questions (FAQs)

  • The recommended land pattern for CRM1206-FX-1004ELF is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While the CRM1206-FX-1004ELF is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
  • To minimize EMI radiation, it's recommended to use a shielded enclosure or a metal can around the CRM1206-FX-1004ELF. Additionally, ensure that the PCB layout and component placement are designed to minimize radiation and coupling.
  • Store CRM1206-FX-1004ELF in a dry, cool place, away from direct sunlight and moisture. Handle the components by the edges to prevent damage to the terminations. Avoid bending or flexing the component during handling or assembly.
  • While the CRM1206-FX-1004ELF is designed to operate in a variety of environments, it's essential to consider the moisture sensitivity level (MSL) of the component. If the application involves high humidity or moisture, ensure that the component is properly sealed or conformally coated to prevent moisture ingress.

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CRM1206-FX-1004ELF Overview

Use the download button to access the CRM1206-FX-1004ELF schematic symbol, PCB footprint, and 3D model.
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CRM1206-FX-1004ELF Alternates

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Part Image CRM1206QFX-1004ELF Bourns Inc

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Part Image CRS1206AFX-1004ELF Bourns Inc

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For a full list of alternate parts for CRM1206-FX-1004ELF, check out Findchips.com