A good thermal design is crucial for the CS5171ED8G. Onsemi recommends a 2-layer or 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended for the top and bottom layers.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, use a heat sink if necessary, and consider derating the device's power dissipation. Onsemi also recommends using a thermistor or thermal sensor to monitor the device's temperature.
Onsemi recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output. X5R or X7R ceramic capacitors are suitable for this application. The capacitor selection should be based on the specific requirements of the design, including voltage rating, ripple current, and ESR.
When troubleshooting issues with the enable pin (EN), ensure that the pin is properly biased and that the voltage level is within the recommended range (1.5V to 5.5V). Also, check for any noise or ringing on the EN pin, and verify that the pin is not being driven by multiple sources.
Onsemi recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. Hand soldering is not recommended due to the device's small size and lead-free finish. Ensure that the PCB is designed with a solder mask to prevent solder bridging.
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CS5171ED8G Overview
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