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CS75-B2GA471KAVKA - TDK

Description: Disc Type Capacitors with Lead (High Voltage Ceramic Capacitors), Capacitance=470pF, DxT: 9x7mm ,F: 7.5mm

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Symbol
CS75-B2GA471KAVKA - TDK - PCB symbol
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PCB Footprints
CS75-B2GA471KAVKA - TDK PCB footprint - Other - Other - CS75-B2GA471KAVKA-2
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3D Models
CS75-B2GA471KAVKA - TDK - 3D model - Other - CS75-B2GA471KAVKA-2
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CS75-B2GA471KAVKA Details

  • Manufacturer Part Number:

    CS75-B2GA471KAVKA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    RADIAL LEADED

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.23.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6.34

  • Additional Feature:

    RATED AC VOLTAGE (V) : 300, SAFETY CLASS X1/Y2

  • Capacitance:

    0.00047 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • Height:

    9 mm

  • Length:

    9 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Multilayer:

    No

  • Negative Tolerance:

    10%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    DISK PACKAGE

  • Package Style:

    Radial

  • Packing Method:

    AMMO PACK

  • Positive Tolerance:

    10%

  • Rated (AC) Voltage (URac):

    440 V

  • Reference Standard:

    AEC-Q200, CSA, CQC, IEC60384-14, UL,VDE

  • Surface Mount:

    NO

  • Temperature Characteristics Code:

    B

  • Temperature Coefficient:

    10% ppm/°C

  • Terminal Pitch:

    7.5 mm

  • Terminal Shape:

    WIRE

  • Width:

    7 mm

CS75-B2GA471KAVKA Frequently Asked Questions (FAQs)

  • The recommended land pattern for the CS75-B2GA471KAVKA can be found in the TDK Corporation's documentation, specifically in the 'Recommended Mounting Pattern' section of the datasheet or in the TDK Corporation's 'Chip Capacitor Land Pattern' application note.
  • The CS75-B2GA471KAVKA is a moisture-sensitive device. It is recommended to store the components in a dry environment with a relative humidity of 10% or less. Before reflow soldering, the components should be baked at 125°C for 24 hours to remove any absorbed moisture.
  • The maximum reflow temperature for the CS75-B2GA471KAVKA is 260°C, with a peak temperature not exceeding 240°C for more than 30 seconds.
  • The CS75-B2GA471KAVKA is designed to withstand moderate vibration levels. However, it's recommended to consult with TDK Corporation's application engineers to determine the suitability of this component for your specific application.
  • The derating curve for the CS75-B2GA471KAVKA can be found in the datasheet or by contacting TDK Corporation's technical support team. The derating curve provides information on the component's performance at elevated temperatures and voltage levels.

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CS75-B2GA471KAVKA Overview

Use the download button to access the CS75-B2GA471KAVKA schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CS75-, or try a keyword search, such as Ceramic Capacitors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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