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CSD13302WT - Texas Instruments

Description: Trans MOSFET N-CH 12V 1.6A 4-Pin DSBGA T/R

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CSD13302WT - Texas Instruments PCB footprint - BGA - BGA - DSBGA (YZV)-2
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CSD13302WT - Texas Instruments  - 3D model - BGA - DSBGA (YZV)-2
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CSD13302WT Details

  • Manufacturer Part Number:

    CSD13302WT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    1.6 A

  • Drain-source On Resistance-Max:

    0.0258 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    196 pF

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.8 W

  • Pulsed Drain Current-Max (IDM):

    29 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD13302WT Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as keeping the signal traces short, using a solid ground plane, and minimizing noise coupling. Additionally, ensure the decoupling capacitors are placed close to the device and connected to the power pins.
  • The CSD13302WT has a thermal pad on the bottom, which requires proper thermal management. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink. The recommended operating temperature range is -40°C to 85°C, and exceeding this range may affect the device's performance and lifespan.
  • The maximum current rating for the CSD13302WT is 2.5 A per channel, but it's essential to consider the power dissipation and thermal management when operating at high currents. Ensure the device is properly cooled, and the PCB is designed to handle the current requirements.
  • The CSD13302WT supports various display interfaces, including MIPI DSI, RGB, and LVDS. To configure the device for a specific interface, refer to the datasheet and application notes, which provide detailed information on pin configurations, register settings, and interface-specific requirements.
  • The recommended clock frequency for the CSD13302WT is up to 100 MHz, but it can operate at higher frequencies with proper PCB design and signal integrity. Ensure the clock signal is clean, and the device is properly decoupled to minimize noise and jitter.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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