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CSD18502KCS - Texas Instruments

Description: 40V, N ch NexFET MOSFET™, single TO-220, 2.9mOhm

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PCB Footprints
CSD18502KCS - Texas Instruments PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - KCS Package 2021
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CSD18502KCS - Texas Instruments  - 3D model - Transistor Outline, Vertical - KCS Package 2021
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CSD18502KCS Details

  • Manufacturer Part Number:

    CSD18502KCS

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

  • Avalanche Energy Rating (Eas):

    330 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0043 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    26 pF

  • JEDEC-95 Code:

    TO-220

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    216 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD18502KCS Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a low-impedance path for the drain pin to the heat sink.
  • Ensure the input voltage (VIN) is within the recommended range (4.5V to 60V). Use a suitable bootstrap capacitor (CBOOT) and a low-ESR output capacitor (COUT) to minimize voltage ripple.
  • Use a common-mode choke (CMC) and a differential-mode filter (DMF) to reduce EMI emissions. Ensure proper PCB layout and component placement to minimize radiation.
  • Implement overcurrent protection (OCP) using a sense resistor and a comparator. Use a voltage supervisor or a Zener diode to protect against overvoltage conditions.
  • Ensure good thermal conductivity between the device and the heat sink. Use thermal interface material (TIM) and a heat sink with a high thermal conductivity coefficient.

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CSD18502KCS Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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