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CSD19502Q5B - Texas Instruments

Description: N-Channel, 3.4mOhm, 80V, SON5x6 NexFET™ Power MOSFET, CSD19502Q5B

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PCB Footprints
CSD19502Q5B - Texas Instruments PCB footprint - Other - Other - Q5B
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CSD19502Q5B - Texas Instruments  - 3D model - Other - Q5B
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CSD19502Q5B Details

  • Manufacturer Part Number:

    CSD19502Q5B

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    274 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0048 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    22 pF

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    195 W

  • Pulsed Drain Current-Max (IDM):

    400 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD19502Q5B Frequently Asked Questions (FAQs)

  • A good PCB layout for the CSD19502Q5B involves keeping the high-current paths short and wide, using multiple vias for thermal relief, and placing the device near the power source to minimize inductance. A 2-layer or 4-layer board is recommended, with the device on the top layer and the power plane on the inner or bottom layer.
  • Proper cooling of the CSD19502Q5B involves providing adequate airflow, using a heat sink with a thermal interface material, and ensuring the device is mounted on a thermally conductive surface. The recommended thermal resistance (RθJA) is ≤ 10°C/W.
  • When selecting input capacitors for the CSD19502Q5B, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). Choose capacitors with a voltage rating ≥ 2x the input voltage, a capacitance value ≥ 10µF, and an ESR ≤ 10mΩ.
  • To troubleshoot issues with the CSD19502Q5B, start by checking the input voltage, output voltage, and current. Verify the PCB layout and thermal design. Use a thermal camera or thermometer to check for hotspots. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Operating the CSD19502Q5B at high temperatures can reduce its lifespan and affect its performance. The device is rated for operation up to 150°C, but prolonged exposure to high temperatures can cause degradation. Ensure proper cooling and thermal management to maintain optimal performance and reliability.

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CSD19502Q5B Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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