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CSD19537Q3 - Texas Instruments

Description: 100V, N ch NexFET MOSFET™, single SON3x3, 14.5mOhm

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CSD19537Q3 - Texas Instruments PCB footprint - Other - Other - DQG_VSON-CLIP
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CSD19537Q3 - Texas Instruments  - 3D model - Other - DQG_VSON-CLIP
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CSD19537Q3 Details

  • Manufacturer Part Number:

    CSD19537Q3

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    55 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    53 A

  • Drain-source On Resistance-Max:

    0.0166 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    17.3 pF

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    219 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD19537Q3 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Ensure the input voltage (VIN) is within the recommended range (4.5V to 18V). Use a high-quality decoupling capacitor (e.g., 10uF) close to the device. Verify the output voltage (VOUT) is within the specified range (0.8V to 3.3V).
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, with a voltage rating of 10V to 25V. Place the capacitor as close as possible to the VIN pin.
  • Ensure the input voltage (VIN) is applied before the enable signal (EN). The enable signal should be asserted after VIN has reached its nominal value. Use a power sequencing controller or a simple RC circuit to ensure proper sequencing.
  • The maximum allowed output current is 3A. However, the device can deliver up to 5A peak current for short durations (e.g., during startup or transient events).

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CSD19537Q3 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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