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CSD22202W15 - Texas Instruments

Description: -8V, P ch NexFET MOSFET™, single WLP 1.5x1.5, 12.2mOhm

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PCB Footprints
CSD22202W15 - Texas Instruments PCB footprint - BGA - BGA - YZF(R-XBGA-N81)
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3D Models
CSD22202W15 - Texas Instruments  - 3D model - BGA - YZF(R-XBGA-N81)
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CSD22202W15 Details

  • Manufacturer Part Number:

    CSD22202W15

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • DS Breakdown Voltage-Min:

    8 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.0174 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    250 pF

  • JESD-30 Code:

    S-XBGA-B9

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    9

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    48 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD22202W15 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the CSD22202W15 is -55°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and consider using a voltage regulator or voltage reference to maintain a stable voltage supply.
  • For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and consider using thermal vias and heat sinks to dissipate heat. Follow Texas Instruments' recommended PCB layout guidelines and thermal management strategies.
  • Use a combination of oscilloscopes, logic analyzers, and debugging tools to identify and isolate issues. Consult the datasheet and application notes for troubleshooting guidelines and common pitfalls to avoid.
  • To minimize EMI and RFI, use proper shielding, grounding, and decoupling techniques. Follow best practices for PCB layout, component placement, and signal routing to reduce electromagnetic interference.

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CSD22202W15 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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