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CSD87334Q3D - Texas Instruments

Description: MOSFET CSD87334Q3D Synchronous Buck NexFET Power Block 8-VSON -55 to 150

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CSD87334Q3D - Texas Instruments PCB footprint - Other - Other - DPB0008A
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CSD87334Q3D - Texas Instruments  - 3D model - Other - DPB0008A
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CSD87334Q3D Details

  • Manufacturer Part Number:

    CSD87334Q3D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    24 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    3.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.05 mm

  • Supply Current-Max (Isup):

    20 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1500 kHz

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn); Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.3 mm

CSD87334Q3D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the CSD87334Q3D is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and consider using a voltage regulator to maintain a stable voltage supply.
  • For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and consider using thermal vias and heat sinks to dissipate heat. Follow the recommended PCB layout guidelines in the datasheet and application notes.
  • To handle the high current requirements, use a robust power delivery system with low-ESR capacitors, and consider using a dedicated power plane or busbar to minimize voltage drops and ensure reliable operation.
  • To minimize EMI and RFI, use proper shielding, grounding, and decoupling techniques, and consider using EMI filters or common-mode chokes to reduce electromagnetic interference.

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CSD87334Q3D Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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