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CSD87335Q3D - Texas Instruments

Description: 30V, Nch synchronous buck NexFET MOSFET™, SON3x3 PowerBlock, 25A

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CSD87335Q3D - Texas Instruments PCB footprint - Other - Other - DQZ (LSON-CLIP)
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CSD87335Q3D - Texas Instruments  - 3D model - Other - DQZ (LSON-CLIP)
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CSD87335Q3D Details

  • Manufacturer Part Number:

    CSD87335Q3D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Date Of Intro:

    2016-02-25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    27 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    25 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.5 mm

  • Supply Current-Max (Isup):

    20 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    1500 kHz

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn); Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.2 mm

CSD87335Q3D Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the CSD87335Q3D is -40°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet, and ensure that the input voltage is within the specified range (typically 4.5V to 18V).
  • For optimal thermal performance, use a multi-layer PCB with a solid ground plane, and ensure good thermal conductivity between the device and the PCB. Follow the recommended land pattern and thermal pad layout in the datasheet.
  • To handle the high current capability, ensure that the PCB traces and vias are designed to handle the maximum current rating, and use adequate heat sinking and thermal management to prevent overheating.
  • The CSD87335Q3D has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges, and avoid excessive voltage or current spikes.

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CSD87335Q3D Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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