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CSD87502Q2T - Texas Instruments

Description: MOSFET 30-V, N channel NexFET power MOSFET, dual SON 2 mm x 2, 42 mOhm, gate ESD protection 6-WSON -55 to 150

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PCB Footprints
CSD87502Q2T - Texas Instruments PCB footprint - Other - Other - DQK_6
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CSD87502Q2T - Texas Instruments  - 3D model - Other - DQK_6
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CSD87502Q2T Details

  • Manufacturer Part Number:

    CSD87502Q2T

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    3.1 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.06 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    29 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.3 W

  • Pulsed Drain Current-Max (IDM):

    23 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

CSD87502Q2T Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a low-thermal-resistance path from the device to the heat sink or thermal pad.
  • Use a low-ESR capacitor for the bootstrap capacitor, and ensure the gate driver circuit is properly decoupled from the power stage. Also, consider using a gate driver IC with a high current capability.
  • The maximum allowed voltage on the VCC pin is 5.5V. Exceeding this voltage may damage the device.
  • Implement a thermal management system, such as a heat sink or thermal pad, to keep the device temperature below 150°C. Also, ensure proper airflow and avoid overheating the surrounding components.
  • Use a pi-filter (L-C-R) or a common-mode choke filter configuration to reduce electromagnetic interference (EMI). The filter values depend on the specific application and frequency range.

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CSD87502Q2T Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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