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CSR1206FT80L0 - Stackpole Electronics, Inc.

Description: RES CS, 1206, 0.08 ohm, 1%, 0.5W

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CSR1206FT80L0 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
CSR1206FT80L0 - Stackpole Electronics, Inc. PCB footprint - Other - Other - CSR1206
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3D Models
CSR1206FT80L0 - Stackpole Electronics, Inc. - 3D model - Other - CSR1206
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CSR1206FT80L0 Details

  • Manufacturer Part Number:

    CSR1206FT80L0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP, ROHS COMPLIANT

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.05 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.55 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.08 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

CSR1206FT80L0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for CSR1206FT80L0 is a rectangular pad with dimensions of 1.5mm x 0.8mm, with a solder mask clearance of 0.2mm. The land pattern should be centered on the component body.
  • The thermal management strategy for CSR1206FT80L0 involves using a thermal pad on the bottom of the device, which should be connected to a copper plane on the PCB. This helps to dissipate heat generated by the device.
  • The recommended soldering profile for CSR1206FT80L0 is a reflow soldering process with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp rate of 3°C/second.
  • The moisture sensitivity level (MSL) of CSR1206FT80L0 is MSL 3, which means that the device can be exposed to a maximum of 168 hours of humidity before soldering.
  • The recommended storage condition for CSR1206FT80L0 is in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%.

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CSR1206FT80L0 Overview

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