The recommended land pattern for CSRF1206FT14L0 is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
To handle thermal considerations for CSRF1206FT14L0, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance (Rth) is 100°C/W. Additionally, avoid placing heat-sensitive components near the CSRF1206FT14L0.
The maximum operating temperature for CSRF1206FT14L0 is 150°C, with a derating of 1.33% per °C above 125°C. It's essential to ensure that the component does not exceed this temperature to prevent damage or degradation.
To ensure the reliability of CSRF1206FT14L0 in high-reliability applications, follow the recommended storage and handling procedures, and ensure that the component is soldered correctly. Additionally, perform thorough testing and inspection, and consider using a conformal coating to protect the component from environmental factors.
The recommended soldering profile for CSRF1206FT14L0 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere, and the component should be soldered within 24 hours of opening the package.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
CSRF1206FT14L0 Overview
Use the download button to access the CSRF1206FT14L0 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like CSRF1,
or try a keyword search, such as Metal Foil Resistors
