CSRF1206FT5L00 footprint, schematic symbol and 3D model by Stackpole Electronics, Inc.

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CSRF1206FT5L00 Details

The recommended land pattern for the CSRF1206FT5L00 is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
The CSRF1206FT5L00 has a thermal resistance of 30°C/W. To handle thermal considerations, ensure good airflow around the component, use a thermal interface material (TIM) if necessary, and consider using a heat sink or thermal pad.
The maximum operating temperature range for the CSRF1206FT5L00 is -55°C to 150°C.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes thermal shock and ensures a strong bond between the component and the PCB.
The recommended storage condition for the CSRF1206FT5L00 is in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%.

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