The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer, and using thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended.
To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating the device.
The maximum allowed voltage derating for the CSRF2010FT8L00 is 10% of the rated voltage. Exceeding this derating may compromise the device's reliability and lifespan.
While the CSRF2010FT8L00 is designed to operate in a variety of environments, it's not recommended for use in high-humidity environments (>80% RH) without proper moisture protection, such as conformal coating or potting.
The recommended storage condition for the CSRF2010FT8L00 is in a dry, cool place (<30°C, <60% RH) with the device stored in its original packaging or an equivalent ESD-protective package.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
CSRF2010FT8L00 Overview
Use the download button to access the CSRF2010FT8L00 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like CSRF2,
or try a keyword search, such as Fixed Resistors
