The recommended land pattern for the CSRN2010JTR200 can be found in the Stackpole Electronics Inc. application note AN-114, which provides detailed guidelines for PCB layout and assembly.
The CSRN2010JTR200 has a thermal resistance of 10°C/W, and it is recommended to use a thermal pad or heat sink to dissipate heat. A minimum of 1 oz copper thickness is recommended for the PCB to ensure effective heat dissipation.
The CSRN2010JTR200 has an operating temperature range of -55°C to 150°C, but it is recommended to operate within the range of -40°C to 125°C for optimal performance and reliability.
The CSRN2010JTR200 is designed for high-frequency applications up to 1 GHz, but it is recommended to consult with Stackpole Electronics Inc. for specific guidance on impedance matching and PCB layout to ensure optimal performance.
The recommended soldering profile for the CSRN2010JTR200 is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. It is recommended to consult with Stackpole Electronics Inc. for specific guidance on soldering and assembly.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
CSRN2010JTR200 Overview
Use the download button to access the CSRN2010JTR200 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like CSRN2,
or try a keyword search, such as Fixed Resistors
