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CUHS15F30,H3F - Toshiba

Description: Small-signal Schottky barrier diode Single 30V, 1.5A, in 2 pin US2H package

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PCB Footprints
CUHS15F30,H3F - Toshiba PCB footprint - Other - Other - US2H_2021
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3D Models
CUHS15F30,H3F - Toshiba  - 3D model - Other - US2H_2021
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CUHS15F30,H3F Details

  • Manufacturer Part Number:

    CUHS15F30,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.52 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CUHS15F30,H3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended derating curves for temperature and current to prevent overheating and thermal runaway.
  • Although not specified in the datasheet, Toshiba recommends limiting voltage transients to 10% of the rated voltage to prevent damage or malfunction.
  • Yes, but be aware of the device's switching characteristics and ensure that the switching frequency is within the recommended range to prevent excessive losses and overheating.
  • Follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and ensure that the device is properly grounded during handling and assembly.

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CUHS15F30,H3F Overview

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