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CUHS20F30,H3F - Toshiba

Description: Schottky Diodes & Rectifiers Sml-Signal Schottky 2A 30V 380pF

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Symbol
CUHS20F30,H3F - Toshiba - PCB symbol
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PCB Footprints
CUHS20F30,H3F - Toshiba PCB footprint - Other - Other - US2H
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3D Models
CUHS20F30,H3F - Toshiba - 3D model - Other - US2H
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CUHS20F30,H3F Details

  • Manufacturer Part Number:

    CUHS20F30,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.47 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    60 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CUHS20F30,H3F Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and consider derating the device's power handling at high temperatures.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure.
  • While the CUHS20F30,H3F is a high-quality device, it may not meet the specific requirements of high-reliability or aerospace applications. Consult with Toshiba or a qualified reliability engineer to determine suitability.
  • Follow standard ESD handling procedures, including using ESD-protective packaging, wrist straps, and mats. Ensure that all personnel handling the device are properly grounded.

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CUHS20F30,H3F Overview

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