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CUHS20S40,H3F - Toshiba

Description: Schottky Diodes & Rectifiers Sml-Signal Schottky 2A 40V 290pF

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PCB Footprints
CUHS20S40,H3F - Toshiba PCB footprint - Other - Other - CUHS20S40,H3F-2
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3D Models
CUHS20S40,H3F - Toshiba  - 3D model - Other - CUHS20S40,H3F-2
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CUHS20S40,H3F Details

  • Manufacturer Part Number:

    CUHS20S40,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.47 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    40 V

  • Reverse Current-Max:

    300 µA

  • Reverse Test Voltage:

    40 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CUHS20S40,H3F Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern is suggested. Refer to the application note for more details.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling capability according to the temperature derating curve.
  • Handle the device with an anti-static wrist strap or mat. Store the device in an anti-static bag or tube. Avoid touching the pins or leads. Follow standard ESD handling procedures.
  • Yes, but ensure the device is operated within the recommended frequency range and follow the application note for high-frequency design considerations. Also, consider the device's parasitic capacitance and inductance.
  • Use the recommended gate resistor value range provided in the datasheet. For more specific requirements, consult the application note or contact Toshiba's technical support for guidance.

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