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CUHS20S60,H3F - Toshiba

Description: Diode 60 V 2A Surface Mount US2H

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PCB Footprints
CUHS20S60,H3F - Toshiba PCB footprint - Other - Other - CUHS20S60,H3F-5
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3D Models
CUHS20S60,H3F - Toshiba  - 3D model - Other - CUHS20S60,H3F-5
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CUHS20S60,H3F Details

  • Manufacturer Part Number:

    CUHS20S60,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.53 V

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Pk Forward Current-Max:

    10 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    650 µA

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CUHS20S60,H3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended derating curves for high-temperature operation.
  • The maximum allowed voltage transient is 20% above the maximum rated voltage, but it's recommended to follow the voltage ramp-up and ramp-down rates specified in the datasheet.
  • Yes, but ensure that the devices are matched in terms of electrical characteristics, and follow the recommended layout and thermal management guidelines to avoid uneven current sharing.
  • Store the devices in a dry, cool place with a relative humidity below 60%, and follow the recommended MSL (Moisture Sensitivity Level) guidelines.

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