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CUHZ36V,H3F - Toshiba

Description: Zener Diodes 36 V Zener Diode, SOD-323HE(US2H) Pd(max):1.2V

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CUHZ36V,H3F - Toshiba - PCB symbol
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PCB Footprints
CUHZ36V,H3F - Toshiba PCB footprint - Other - Other - CUHZ36V,H3F-2
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CUHZ36V,H3F - Toshiba - 3D model - Other - CUHZ36V,H3F-2
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CUHZ36V,H3F Details

  • Manufacturer Part Number:

    CUHZ36V,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6.4

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    100 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1.2 W

  • Reference Standard:

    IEC-61000-4-2, 4-5

  • Reference Voltage-Nom:

    36 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Test Voltage:

    32.5 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Voltage Tol-Max:

    5.56%

  • Working Test Current:

    9 mA

CUHZ36V,H3F Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Implement a heat sink or thermal management system, and ensure the device is operated within the recommended temperature range (TJ = -40°C to 150°C).
  • The maximum allowed voltage transient is 40V, as specified in the datasheet. Exceeding this may cause damage to the device.
  • Yes, the CUHZ36V,H3F is suitable for high-frequency switching applications up to 100 kHz. However, ensure proper PCB layout and decoupling to minimize EMI and ringing.
  • Implement ESD protection measures such as using ESD-sensitive handling procedures, and incorporating ESD protection devices (e.g., TVS diodes) in the circuit design.

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