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CUS05F30,H3F - Toshiba

Description: Schottky Diodes & Rectifiers 20V Vrrm 500mA IO 5A IFSM .45Vf Max

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Symbol
CUS05F30,H3F - Toshiba - PCB symbol
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PCB Footprints
CUS05F30,H3F - Toshiba PCB footprint - Other - Other - USC (1-1E1A)
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3D Models
CUS05F30,H3F - Toshiba - 3D model - Other - USC (1-1E1A)
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CUS05F30,H3F Details

  • Manufacturer Part Number:

    CUS05F30,H3F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.45 V

  • JESD-30 Code:

    R-PDSO-G2

  • Non-rep Pk Forward Current-Max:

    5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    50 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CUS05F30,H3F Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer of the PCB, connected to the thermal pad of the CUS05F30,H3F. This will help to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, ensuring good thermal design and heat dissipation can help to reduce the risk of overheating.
  • When handling the CUS05F30,H3F, it is recommended to take precautions to prevent electrostatic discharge (ESD) damage. This includes using an ESD wrist strap or mat, and handling the device by the body rather than the leads.
  • To determine a suitable heat sink for the CUS05F30,H3F, consider the maximum power dissipation and thermal resistance of the device. A heat sink with a thermal resistance of less than 10°C/W is recommended. Additionally, the heat sink should be designed to fit the device's package and thermal pad.
  • The CUS05F30,H3F meets various reliability and quality standards, including AEC-Q101 and ISO/TS 16949. These standards ensure that the device meets certain requirements for automotive applications.

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CUS05F30,H3F Overview

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