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CUS05S30,H3F - Toshiba

Description: Diode 30 V 500mA Surface Mount USC

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Symbol
CUS05S30,H3F - Toshiba - PCB symbol
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PCB Footprints
CUS05S30,H3F - Toshiba PCB footprint - Other - Other - CUS05S30,H3F-2
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3D Models
CUS05S30,H3F - Toshiba - 3D model - Other - CUS05S30,H3F-2
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CUS05S30,H3F Details

  • Manufacturer Part Number:

    CUS05S30,H3F

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.47 V

  • JESD-30 Code:

    R-PDSO-G2

  • Non-rep Pk Forward Current-Max:

    5 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    300 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CUS05S30,H3F Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer of the PCB, connected to the thermal pad of the CUS05S30,H3F. This will help to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, ensuring good thermal design and heat dissipation can help to reduce the risk of overheating.
  • The CUS05S30,H3F is a sensitive electronic component and requires proper ESD protection and handling precautions. It is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.
  • The CUS05S30,H3F is a commercial-grade device and may not be suitable for high-reliability or automotive applications. It is recommended to consult with Toshiba America Electronic Components or a qualified engineer to determine the suitability of this device for such applications.
  • The recommended soldering conditions for the CUS05S30,H3F are a peak temperature of 260°C, with a soldering time of 10 seconds or less. It is recommended to follow the soldering guidelines provided in the datasheet or to consult with a qualified engineer.

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CUS05S30,H3F Overview

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