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CVFD20065A - Wolfspeed

Description: SiC Schottky Diode 650V 26A TO220-2

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CVFD20065A - Wolfspeed - PCB symbol
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PCB Footprints
CVFD20065A - Wolfspeed PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - CVFD20065A
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CVFD20065A - Wolfspeed - 3D model - Transistor Outline, Vertical - CVFD20065A
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CVFD20065A Details

  • Manufacturer Part Number:

    CVFD20065A

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-220, 2 PIN

  • Country Of Origin:

    Mainland China, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Wolfspeed

  • YTEOL:

    0

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.45 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • Non-rep Pk Forward Current-Max:

    206 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    57 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    187.5 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    80 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

CVFD20065A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, derate the device's power handling capability according to the temperature derating curve in the datasheet.
  • A gate driver with a high current capability (>1A) and a low output impedance is recommended. The gate driver should be able to provide a voltage swing of at least 10V to ensure proper switching.
  • Use a voltage clamp or a transient voltage suppressor (TVS) to protect the device from overvoltage. Implement overcurrent protection using a current sense resistor and a comparator or a dedicated overcurrent protection IC.
  • Use a wire bonding technique with a 1-mil aluminum wire or a gold wire. For soldering, use a solder with a melting point above 260°C and follow the recommended soldering profile to prevent thermal damage.

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CVFD20065A Overview

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For a full list of alternate parts for CVFD20065A, check out Findchips.com