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CY14B101LA-SZ45XI - Infineon

Description: NVRAM 1Mb 3V 45ns 128K x 8 nvSRAM

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CY14B101LA-SZ45XI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 32-pin SOIC (300 Mil) Package Outline, 51-85127
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3D Models
CY14B101LA-SZ45XI - Infineon  - 3D model - Small Outline Packages - 32-pin SOIC (300 Mil) Package Outline, 51-85127
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CY14B101LA-SZ45XI Details

  • Manufacturer Part Number:

    CY14B101LA-SZ45XI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Access Time-Max:

    45 ns

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    20.726 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    NON-VOLATILE SRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.052 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    7.5 mm

CY14B101LA-SZ45XI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 0.1uF decoupling capacitor between VCC and GND near the device.
  • Use a voltage supervisor or a power-on reset circuit to ensure that the device is fully powered up before accessing the memory. Also, use a capacitor to filter out power noise and ensure a clean power-up sequence.
  • The maximum operating frequency for the CY14B101LA-SZ45XI is 108 MHz. However, the actual frequency may vary depending on the system design and operating conditions.
  • Yes, but ensure that the voltage domains are properly isolated and that the device is powered from a single voltage source. Use level shifters or voltage translators if necessary to ensure signal integrity.
  • Implement error detection and correction mechanisms, such as ECC or checksums, to detect and correct errors during write operations. Also, use a write-verify mechanism to ensure data integrity.

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CY14B101LA-SZ45XI Overview

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Part Image CY14B101LA-SZ45XCT Cypress Semiconductor

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