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CY14B104NA-ZS45XI - Infineon

Description: NVRAM 4Mb 3V 45ns 256K x 16 nvSRAM

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CY14B104NA-ZS45XI - Infineon - PCB symbol
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PCB Footprints
CY14B104NA-ZS45XI - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 44-Pin TSOP II (51-85087)
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CY14B104NA-ZS45XI - Infineon - 3D model - Small Outline Packages - 44-Pin TSOP II (51-85087)
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CY14B104NA-ZS45XI Details

  • Manufacturer Part Number:

    CY14B104NA-ZS45XI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP2-44

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    45 ns

  • JESD-30 Code:

    R-PDSO-G44

  • JESD-609 Code:

    e4

  • Length:

    18.415 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    NON-VOLATILE SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP2

  • Package Equivalence Code:

    TSOP44,.46,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.194 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.052 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    10.16 mm

CY14B104NA-ZS45XI Frequently Asked Questions (FAQs)

  • Infineon recommends following the PCB layout guidelines provided in the application note AN201305-01, which includes recommendations for signal routing, power supply decoupling, and thermal management.
  • The CY14B104NA-ZS45XI requires a specific power-up and power-down sequence to ensure proper operation. Refer to the application note AN201305-01 for detailed guidelines on power sequencing and voltage ramp-up/ramp-down rates.
  • The CY14B104NA-ZS45XI has a maximum junction temperature of 150°C. Ensure proper thermal management by providing adequate heat sinking, using thermal interface materials, and following the thermal design guidelines in the application note AN201305-01.
  • Implement a write protection mechanism using the WP pin and the WPEN bit in the Status Register. Refer to the datasheet and application note AN201305-01 for detailed information on write protection implementation.
  • For high-reliability or automotive applications, ensure that the device is operated within the recommended temperature range, and follow the guidelines for power supply decoupling, signal routing, and thermal management. Additionally, consider implementing error detection and correction mechanisms, such as ECC or CRC, to ensure data integrity.

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CY14B104NA-ZS45XI Overview

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