DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE
Clock Frequency-Max (fCLK):
1 MHz
Data Retention Time-Min:
11
Endurance:
10000000000000 Write/Erase Cycles
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e3
Length:
4.889 mm
Memory Density:
4096 bit
Memory IC Type:
FRAM
Memory Width:
8
Moisture Sensitivity Level:
3
Number of Functions:
1
Number of Terminals:
8
Number of Words:
512 words
Number of Words Code:
512
Operating Mode:
SYNCHRONOUS
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Organization:
512X8
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Parallel/Serial:
SERIAL
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.727 mm
Serial Bus Type:
I2C
Standby Current-Max:
0.00002 A
Standby Voltage-Min:
3 V
Supply Current-Max:
0.00034 mA
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
3 V
Supply Voltage-Nom (Vsup):
3.3 V
Surface Mount:
YES
Technology:
CMOS
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.8985 mm
Write Protection:
HARDWARE
CY15B004J-SXE Frequently Asked Questions (FAQs)
Infineon recommends a PCB layout with a solid copper plane on the bottom layer, connected to the thermal pad of the device, to ensure efficient heat dissipation. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using thermal interface materials and heat sinks to reduce thermal resistance.
Infineon recommends soldering the CY15B004J-SXE using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Hand soldering is not recommended due to the device's small size and high pin count.
To ensure proper operation, it's essential to follow the recommended power-up and power-down sequences, including ramp-up and ramp-down times, to prevent damage to the device or other components on the board.
When using the CY15B004J-SXE in a high-reliability or safety-critical application, it's essential to follow Infineon's guidelines for functional safety and reliability, including fault tree analysis, failure mode effects analysis, and safety integrity level (SIL) classification.
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CY15B004J-SXE Overview
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