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CY15B108QN-40SXI - Infineon

Description: F-RAM Excelon LP 40 MHz 8-EIAJ

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CY15B108QN-40SXI Details

  • Manufacturer Part Number:

    CY15B108QN-40SXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    2kv ESD available

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    1000000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5.28 mm

  • Memory Density:

    8388608 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.03 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00012 A

  • Standby Voltage-Min:

    1.8 V

  • Supply Current-Max:

    0.0032 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    5.23 mm

  • Write Protection:

    HARDWARE/SOFTWARE

CY15B108QN-40SXI Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and thermal management. This includes using a 4-layer PCB with a solid ground plane, placing decoupling capacitors close to the device, and ensuring good thermal conductivity to dissipate heat.
  • To ensure reliable data retention and prevent data corruption, it's essential to follow the recommended programming and erase procedures, use the correct voltage levels, and implement error detection and correction mechanisms in your design.
  • The asynchronous mode allows for faster access times, while the synchronous mode provides better noise immunity. System designers should consider the trade-offs between access time, power consumption, and noise immunity when choosing the operating mode.
  • It's crucial to follow the recommended power-up and power-down sequences to prevent damage or malfunction. This includes ensuring a stable power supply, controlling the voltage ramp-up and ramp-down rates, and implementing power-on reset circuits.
  • When using the device in harsh environments, consider the device's operating temperature range, radiation tolerance, and potential for single-event effects. Implementing error detection and correction mechanisms, as well as using radiation-hardened components, can help mitigate these effects.

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