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CY15V116QN-40BKXI - Infineon

Description: F-RAM F-RAM Memory Serial

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PCB Footprints
CY15V116QN-40BKXI - Infineon PCB footprint - BGA - BGA - 24L FBGA 8  6  1.2 mm BK24A package outline, 001-97209
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3D Models
CY15V116QN-40BKXI - Infineon  - 3D model - BGA - 24L FBGA 8  6  1.2 mm BK24A package outline, 001-97209
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CY15V116QN-40BKXI Details

  • Manufacturer Part Number:

    CY15V116QN-40BKXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    1000000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B24

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TBGA

  • Package Equivalence Code:

    BGA24,5X5,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.0002525 A

  • Standby Voltage-Min:

    1.71 V

  • Supply Current-Max:

    0.0036 mA

  • Supply Voltage-Max (Vsup):

    1.89 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

  • Write Protection:

    HARDWARE/SOFTWARE

CY15V116QN-40BKXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The CY15V116QN-40BKXI has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Follow Infineon's thermal management guidelines in the datasheet and application notes.
  • The CY15V116QN-40BKXI has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (Tj) should not exceed 150°C. Ensure proper thermal management to prevent overheating.
  • Yes, the CY15V116QN-40BKXI is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, ensure you follow Infineon's guidelines for qualification, testing, and validation for your specific use case.
  • Infineon provides a troubleshooting guide in their application note AN2013-01, which covers common issues, debugging techniques, and fault analysis. Additionally, consult the datasheet and contact Infineon's support team if needed.

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