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CY2302SXC-1 - Infineon

Description: Frequency Multiplier and Zero Delay Buffer

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CY2302SXC-1 - Infineon - PCB symbol
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CY2302SXC-1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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CY2302SXC-1 - Infineon - 3D model - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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CY2302SXC-1 Details

  • Manufacturer Part Number:

    CY2302SXC-1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES WITH 5V SUPPLY

  • Family:

    23S

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.889 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    2

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    0.35 ns

  • Propagation Delay (tpd):

    0.35 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.8985 mm

  • fmax-Min:

    133 MHz

CY2302SXC-1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2341, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CY2302SXC-1 requires a stable power supply with adequate decoupling capacitors to ensure proper operation. Infineon recommends using a 3.3V power supply with a minimum of 10uF decoupling capacitor between VCC and GND, and an additional 100nF capacitor between VCC and GND for high-frequency noise filtering.
  • The CY2302SXC-1 can support clock frequencies up to 200 MHz, but the actual maximum frequency may vary depending on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information on clock frequency limitations.
  • The CY2302SXC-1 can be configured for SSC mode by setting the appropriate register bits. Infineon provides a detailed description of the SSC mode configuration in the datasheet and application notes, including the required register settings and timing diagrams.
  • The CY2302SXC-1 has a thermal pad on the bottom of the package that must be connected to a thermal ground plane on the PCB to ensure proper heat dissipation. Infineon recommends using a thermal interface material (TIM) between the thermal pad and the thermal ground plane to minimize thermal resistance.

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CY2302SXC-1 Overview

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