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CY2305CSXI-1 - Infineon

Description: Clock Buffer 3.3VZDB IND

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CY2305CSXI-1 - Infineon - PCB symbol
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CY2305CSXI-1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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CY2305CSXI-1 - Infineon - 3D model - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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CY2305CSXI-1 Details

  • Manufacturer Part Number:

    CY2305CSXI-1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Family:

    2305

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.889 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.2 ns

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.8985 mm

  • fmax-Min:

    133.33 MHz

CY2305CSXI-1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2341, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • According to Infineon's datasheet, the CY2305CSXI-1 requires a 3.3V power supply with a minimum of 10uF decoupling capacitance between VCC and GND. Additionally, it's recommended to use a low-ESR capacitor and to place it as close as possible to the device.
  • The CY2305CSXI-1 can support clock frequencies up to 133 MHz, but the actual frequency limit may depend on the specific application, PCB layout, and signal integrity. It's recommended to consult Infineon's application notes and perform simulations to ensure signal integrity.
  • To configure the CY2305CSXI-1 for SSC mode, you need to set the SSC_EN pin high and adjust the SSC_MOD and SSC_FREQ pins according to the desired spread spectrum characteristics. Refer to Infineon's datasheet and application notes for detailed configuration guidelines.
  • The CY2305CSXI-1 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, Infineon recommends using thermal vias and a heat sink if necessary, depending on the specific application and operating conditions.

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CY2305CSXI-1 Overview

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