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CY2305SXC-1HT - Infineon

Description: Low Cost 3.3-V Zero Delay Buffer

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CY2305SXC-1HT - Infineon - PCB symbol
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PCB Footprints
CY2305SXC-1HT - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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3D Models
CY2305SXC-1HT - Infineon - 3D model - Small Outline Packages - 8-PIN SOIC (150 mils) 51-85066
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CY2305SXC-1HT Details

  • Manufacturer Part Number:

    CY2305SXC-1HT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Family:

    2305

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.889 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.8985 mm

  • fmax-Min:

    133.33 MHz

CY2305SXC-1HT Frequently Asked Questions (FAQs)

  • A good PCB layout for the CY2305SXC-1HT involves keeping the clock input traces short and shielded, using a solid ground plane, and minimizing the distance between the device and the clock source. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to decouple the power supply with a 10uF capacitor.
  • To ensure proper power-up and initialization of the CY2305SXC-1HT, make sure to follow the recommended power-up sequence, which involves applying VCC before the clock signal. Also, ensure that the clock signal is stable and within the recommended frequency range before enabling the output.
  • The CY2305SXC-1HT has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power for extended periods. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • To troubleshoot issues with the CY2305SXC-1HT, use an oscilloscope to verify the clock signal quality and output signal integrity. Check for signal attenuation, jitter, and noise. Also, verify that the device is properly powered and initialized, and that the PCB layout is correct.
  • Yes, the CY2305SXC-1HT is a high-frequency device and requires proper EMI/EMC design considerations. Use shielding, filtering, and grounding techniques to minimize electromagnetic interference. Follow the recommended PCB layout guidelines and use a metal shield or enclosure to reduce radiation.

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CY2305SXC-1HT Overview

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