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CY2305SXI-1HT - Infineon

Description: Fanout Buffer (Distribution), Zero Delay Buffer IC 133.33MHz 1 8-SOIC (0.154", 3.90mm Width)

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CY2305SXI-1HT - Infineon - PCB symbol
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PCB Footprints
CY2305SXI-1HT - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-pin SOIC (150 Mils)-ren3
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CY2305SXI-1HT - Infineon - 3D model - Small Outline Packages - 8-pin SOIC (150 Mils)-ren3
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CY2305SXI-1HT Details

  • Manufacturer Part Number:

    CY2305SXI-1HT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Family:

    2305

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.889 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.8985 mm

  • fmax-Min:

    133.33 MHz

CY2305SXI-1HT Frequently Asked Questions (FAQs)

  • A good PCB layout for the CY2305SXI-1HT involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper powering and decoupling, use a high-quality power supply with low ripple and noise, and decouple the device with a 10uF capacitor in parallel with a 100nF capacitor, placed as close to the device as possible.
  • The CY2305SXI-1HT can support clock frequencies up to 200 MHz, but the actual frequency limit may vary depending on the specific application and PCB layout.
  • To configure the CY2305SXI-1HT for spread spectrum clocking, set the SS pin high and adjust the frequency modulation rate and deviation using external resistors and capacitors according to the datasheet.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the device. The device can operate up to 85°C, but reducing the junction temperature can increase reliability and lifespan.

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CY2305SXI-1HT Overview

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