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CY2309SXI-1 - Infineon

Description: Zero Delay Buffer

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CY2309SXI-1 - Infineon - PCB symbol
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PCB Footprints
CY2309SXI-1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SOIC16-ren2
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CY2309SXI-1 - Infineon - 3D model - Small Outline Packages - SOIC16-ren2
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CY2309SXI-1 Details

  • Manufacturer Part Number:

    CY2309SXI-1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Philippines, Taiwan

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Family:

    2309

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.893 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.8985 mm

  • fmax-Min:

    133.33 MHz

CY2309SXI-1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2341, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • According to Infineon's datasheet, the CY2309SXI-1 requires a 3.3V power supply with a minimum of 10uF decoupling capacitor between VCC and GND, and an additional 100nF capacitor between VCC and GND for each output bank. Proper power supply decoupling is crucial to ensure stable operation and minimize noise.
  • Although the datasheet specifies a maximum clock frequency of 133 MHz, Infineon's application note AN2341 recommends a maximum clock frequency of 100 MHz for optimal performance and to ensure reliable operation.
  • To configure the CY2309SXI-1 for SSC mode, set the SSC_EN pin high and program the SSC frequency and modulation rate using the I2C interface. Refer to the datasheet and application note AN2341 for detailed configuration and programming guidelines.
  • The CY2309SXI-1 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. Additionally, ensure good airflow around the device and consider using thermal vias or heat sinks if operating in high-temperature environments.

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CY2309SXI-1 Overview

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