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CY2309SXI-1H - Infineon

Description: Zero Delay Buffer

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CY2309SXI-1H - Infineon - PCB symbol
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CY2309SXI-1H - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SOIC16-ren2
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CY2309SXI-1H - Infineon - 3D model - Small Outline Packages - SOIC16-ren2
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CY2309SXI-1H Details

  • Manufacturer Part Number:

    CY2309SXI-1H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Family:

    2309

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.893 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.8985 mm

  • fmax-Min:

    133.33 MHz

CY2309SXI-1H Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2341, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • According to Infineon's recommendations, the CY2309SXI-1H requires a stable power supply with a minimum of 3.3V and a maximum of 5V. Decoupling capacitors (e.g., 100nF and 10uF) should be placed close to the device to filter out noise and ensure stable operation.
  • The CY2309SXI-1H supports clock frequencies up to 200 MHz, but the actual frequency limit may depend on the specific application, PCB layout, and signal integrity. It's recommended to consult Infineon's application notes and perform thorough signal integrity analysis to ensure reliable operation.
  • The CY2309SXI-1H supports SSC operation, which can be configured through the device's control pins (e.g., SSC_EN and SSC_FREQ). Refer to the datasheet and application notes for specific configuration details and recommended settings.
  • The CY2309SXI-1H has a maximum junction temperature (Tj) of 150°C. To ensure reliable operation, it's essential to implement a thermal management strategy, such as using thermal vias, heat sinks, or thermal interface materials, to keep the device temperature below the maximum rating.

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CY2309SXI-1H Overview

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