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CY2309ZXI-1H - Infineon

Description: Zero Delay Buffer

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CY2309ZXI-1H - Infineon - PCB symbol
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CY2309ZXI-1H - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - tssop 16 pin
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CY2309ZXI-1H - Infineon - 3D model - Small Outline Packages - tssop 16 pin
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CY2309ZXI-1H Details

  • Manufacturer Part Number:

    CY2309ZXI-1H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Country Of Origin:

    Philippines, Taiwan

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Family:

    2309

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of True Outputs:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.25 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    4.4 mm

  • fmax-Min:

    133.33 MHz

CY2309ZXI-1H Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2341, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • According to Infineon's recommendations, the CY2309ZXI-1H requires a stable power supply with a minimum of 3.3V and a maximum of 5V. Decoupling capacitors (e.g., 100nF and 10uF) should be placed close to the device to filter out noise and ensure stable operation.
  • The CY2309ZXI-1H supports clock frequencies up to 133 MHz, but the actual frequency limit may depend on the specific application, PCB layout, and signal integrity. It's recommended to consult Infineon's application notes and technical support for specific guidance.
  • The CY2309ZXI-1H supports SSC operation, which can be configured through the device's control pins (e.g., SSC_EN and SSC_FREQ). Refer to the datasheet and application notes for specific configuration details and recommended settings.
  • The CY2309ZXI-1H has a thermal junction-to-ambient resistance (RθJA) of 45°C/W. To ensure reliable operation, it's recommended to implement a thermal management strategy, such as using a heat sink, thermal vias, or a thermally conductive PCB material, to keep the device temperature below the maximum operating temperature (Tj) of 125°C.

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