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CY23EP05SXC-1 - Infineon

Description: 2.5 V or 3.3 V,10-220-MHz, Low Jitter, 5 Output Zero Delay Buffer

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CY23EP05SXC-1 - Infineon - PCB symbol
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CY23EP05SXC-1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-pin SOIC (150 Mils) Package
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CY23EP05SXC-1 - Infineon - 3D model - Small Outline Packages - 8-pin SOIC (150 Mils) Package
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CY23EP05SXC-1 Details

  • Manufacturer Part Number:

    CY23EP05SXC-1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES AT 3.3V SUPPLY

  • Family:

    23EP

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.889 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Propagation Delay (tpd):

    0.2 ns

  • Qualification Status:

    Not Qualified

  • Same Edge Skew-Max (tskwd):

    0.1 ns

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Max (Vsup):

    2.7 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.9 mm

  • fmax-Min:

    220 MHz

CY23EP05SXC-1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN215, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CY23EP05SXC-1 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat efficiently. Ensure good thermal conductivity by using a thermal interface material (TIM) and a heat sink if necessary. Follow the thermal management guidelines in the datasheet and application notes.
  • To minimize EMI and RFI, use a shielded enclosure, and ensure the PCB layout follows good electromagnetic compatibility (EMC) practices. Use a common mode choke or ferrite bead on the power lines, and consider adding shielding cans or metal enclosures around sensitive components.
  • Implement OVP and UVP using external components such as zener diodes, TVS diodes, or voltage supervisors. The specific implementation depends on the system requirements and voltage rails. Consult the datasheet and application notes for guidance.
  • Ensure proper power sequencing by following the recommended power-up and power-down sequences in the datasheet. Use a power sequencer or a supervisor IC to control the power rails and prevent damage to the device or other components.

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CY23EP05SXC-1 Overview

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