Part Image

CY62167GE30-45BV1XI - Infineon

Description: SRAM Micropower SRAMs

Download CY62167GE30-45BV1XI Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
CY62167GE30-45BV1XI - Infineon PCB footprint - BGA - BGA - 48-ball VFBGA (6 × 8 × 1.0 mm) Package Outline, 51-85150
click to zoom
3D Models
CY62167GE30-45BV1XI - Infineon  - 3D model - BGA - 48-ball VFBGA (6 × 8 × 1.0 mm) Package Outline, 51-85150
click to zoom

CY62167GE30-45BV1XI Details

  • Manufacturer Part Number:

    CY62167GE30-45BV1XI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-48

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    45 ns

  • Alternate Memory Width:

    8

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    1048576 words

  • Number of Words Code:

    1000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

CY62167GE30-45BV1XI Frequently Asked Questions (FAQs)

  • The CY62167GE30-45BV1XI can operate from -40°C to 85°C (industrial temperature range) and from -40°C to 125°C (extended temperature range) with reduced performance.
  • The CY62167GE30-45BV1XI requires a power-up sequence where VCC must be applied before VCCQ, and VCCQ must be removed before VCC during power-down. Additionally, the chip select (S) and output enable (OE) pins must be in a logic high state during power-up and power-down.
  • The CY62167GE30-45BV1XI supports clock frequencies up to 45 MHz.
  • To ensure data integrity, it is recommended to use a voltage supervisor or a power-on reset (POR) circuit to ensure that the SRAM is not accessed during power-up and power-down cycles. Additionally, the SRAM should be in a standby mode (CE = HIGH) during power-down to minimize power consumption.
  • Yes, the CY62167GE30-45BV1XI has a separate VCCQ pin for the output buffers, which allows it to interface with systems having different voltage domains. However, ensure that the voltage levels are within the recommended operating conditions.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

CY62167GE30-45BV1XI Overview

Use the download button to access the CY62167GE30-45BV1XI schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CY621, or try a keyword search, such as SRAMs

Parts related to CY62167GE30-45BV1XI

Showing 0 results