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CY62187G30-55BAXI - Infineon

Description: SRAM Micropower SRAMs

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CY62187G30-55BAXI - Infineon PCB footprint - BGA - BGA - 48L FBGA 8 × 9.5 × 1.4mm
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CY62187G30-55BAXI - Infineon  - 3D model - BGA - 48L FBGA 8 × 9.5 × 1.4mm
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CY62187G30-55BAXI Details

  • Manufacturer Part Number:

    CY62187G30-55BAXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    VFBGA-48

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Access Time-Max:

    55 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    9.5 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    48

  • Number of Words:

    4194304 words

  • Number of Words Code:

    4000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4MX16

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA48,6X8,30

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Seated Height-Max:

    1.4 mm

  • Standby Current-Max:

    0.000038 A

  • Standby Voltage-Min:

    1.5 V

  • Supply Current-Max:

    0.055 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Width:

    8 mm

CY62187G30-55BAXI Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 4-layer PCB with a solid ground plane, and to place thermal vias under the package to dissipate heat efficiently.
  • To ensure signal integrity, use controlled impedance traces, add series termination resistors, and consider using differential signaling. Also, follow the recommended routing guidelines and layout considerations outlined in the datasheet.
  • The power-up sequence should be VCCQ, then VCC, and finally VREF. For power-down, the sequence should be reversed. Ensure that VCCQ is powered down last to prevent any unwanted current flow.
  • Use a JTAG adapter or a debug probe that supports the IEEE 1149.1 standard. Ensure that the JTAG clock frequency does not exceed 10 MHz, and use the recommended JTAG signal termination and routing guidelines.
  • Follow the recommended PCB layout and shielding guidelines to minimize EMI. Use a metal shield or a Faraday cage to enclose the device, and ensure that all cables and connectors are properly shielded.

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CY62187G30-55BAXI Overview

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