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CY74FCT162373ATPVC - Texas Instruments

Description: Texas Instruments CY74FCT162373ATPVC 16bit-Bit Latch, Transparent D Type, 3 State, 48-Pin SSOP

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CY74FCT162373ATPVC - Texas Instruments - PCB symbol
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CY74FCT162373ATPVC - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DL (R-PDSO-G48)
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CY74FCT162373ATPVC - Texas Instruments - 3D model - Small Outline Packages - DL (R-PDSO-G48)
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CY74FCT162373ATPVC Details

  • Manufacturer Part Number:

    CY74FCT162373ATPVC

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SSOP

  • Pin Count:

    48

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW/HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    FCT

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    15.875 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    16

  • Number of Ports:

    2

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE WITH SERIES RESISTOR

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP48,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.5 mA

  • Prop. Delay@Nom-Sup:

    5.2 ns

  • Propagation Delay (tpd):

    6.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.79 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.49 mm

CY74FCT162373ATPVC Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following the guidelines in the 'High-Speed Board Layout Guidelines' application report (SLVA626) for optimal performance. This includes using a solid ground plane, minimizing trace lengths, and using controlled impedance traces.
  • To ensure signal integrity, use a termination scheme such as series termination or parallel termination, and consider using a signal integrity analysis tool like TI's IBIS Model or a third-party tool like HyperLynx to simulate and optimize the design.
  • The maximum operating frequency of the CY74FCT162373ATPVC is 200 MHz, but this can vary depending on the specific application and system design. It's recommended to consult the datasheet and perform simulations to determine the maximum frequency for a specific design.
  • It's recommended to follow the power sequencing guidelines in the datasheet and ensure that the power supply voltage (VCC) is stable and within the recommended range before applying clock and input signals. A power-up reset circuit can be implemented using a voltage supervisor or a reset generator IC.
  • The recommended method for thermal management is to use a heat sink or a thermal pad on the exposed pad of the QFN package. Ensure good thermal conductivity between the device and the heat sink or thermal pad, and follow the thermal design guidelines in the datasheet.

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CY74FCT162373ATPVC Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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