CY7C2665KV18-550BZI - Infineon

CY7C2665KV18-550BZI Details

• Manufacturer Part Number:

  CY7C2665KV18-550BZI

• Part Life Cycle Code:

  Active

• ECCN Code:

  3A991.b.2.a

• HTS Code:

  8542.32.00.41

• Factory Lead Time:

  11 Weeks

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  5

• Access Time-Max:

  0.45 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• Clock Frequency-Max (fCLK):

  550 MHz

• I/O Type:

  SEPARATE

• JESD-30 Code:

  R-PBGA-B165

• JESD-609 Code:

  e0

• Length:

  17 mm

• Memory Density:

  150994944 bit

• Memory IC Type:

  QDR II SRAM

• Memory Width:

  36

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  165

• Number of Words:

  4194304 words

• Number of Words Code:

  4000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  4MX36

• Output Characteristics:

  3-STATE

• Output Enable:

  NO

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Equivalence Code:

  BGA165,11X15,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.4 mm

• Standby Current-Max:

  0.5 A

• Standby Voltage-Min:

  1.7 V

• Supply Current-Max:

  1.52 mA

• Supply Voltage-Max (Vsup):

  1.9 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Lead (Sn/Pb)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Width:

  15 mm