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CY7C4122KV13-933FCXI - Infineon

Description: SRAM Chip Sync Single 1.3V 144M-bit 8M x 18 361-Pin FCBGA Tray

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CY7C4122KV13-933FCXI - Infineon PCB footprint - BGA - BGA - 361-ball FCBGA (21 × 21 × 2.515 mm)
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CY7C4122KV13-933FCXI - Infineon  - 3D model - BGA - 361-ball FCBGA (21 × 21 × 2.515 mm)
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CY7C4122KV13-933FCXI Details

  • Manufacturer Part Number:

    CY7C4122KV13-933FCXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-361

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • JESD-30 Code:

    S-PBGA-B361

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Memory Density:

    150994944 bit

  • Memory IC Type:

    QDR SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    361

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX18

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Parallel/Serial:

    PARALLEL

  • Seated Height-Max:

    2.765 mm

  • Supply Voltage-Max (Vsup):

    1.34 V

  • Supply Voltage-Min (Vsup):

    1.26 V

  • Supply Voltage-Nom (Vsup):

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    21 mm

CY7C4122KV13-933FCXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout and thermal management guide in their application note AN54452. It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • The CY7C4122KV13-933FCXI requires a specific power sequencing and voltage regulation scheme. Infineon recommends using a dedicated power management IC (PMIC) like the Infineon TLE9263-2QX or a similar device to ensure proper power-up and power-down sequences.
  • The recommended operating conditions for the CY7C4122KV13-933FCXI are specified in the datasheet. For temperature and voltage derating, refer to the Infineon application note AN54452, which provides detailed guidelines for derating the device's performance under various operating conditions.
  • Infineon provides a troubleshooting guide in their application note AN54452, which covers common failure modes, debugging techniques, and troubleshooting methods. Additionally, engineers can use Infineon's development boards and evaluation kits to test and validate their designs.
  • The CY7C4122KV13-933FCXI is designed to meet EMI and EMC regulatory standards. Infineon provides guidelines for EMI and EMC compliance in their application note AN54452. Engineers should also follow best practices for PCB layout, shielding, and filtering to minimize EMI and ensure compliance with regulatory standards.

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CY7C4122KV13-933FCXI Overview

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