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CY8C4127AXI-S455 - Infineon

Description: IC MCU 32BIT 128KB FLASH 64TQFP

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CY8C4127AXI-S455 - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-pin TQFP Package (0.8-mm Pitch) Outline
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CY8C4127AXI-S455 - Infineon  - 3D model - Quad Flat Packages - 64-pin TQFP Package (0.8-mm Pitch) Outline
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CY8C4127AXI-S455 Details

  • Manufacturer Part Number:

    CY8C4127AXI-S455

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP64,.63SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    PROGRAMMABLE SoC

CY8C4127AXI-S455 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN215106, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise and EMI.
  • The CY8C4127AXI-S455 has a built-in secure boot mechanism that can be used to ensure the authenticity and integrity of the firmware. Infineon provides a Secure Boot SDK and documentation that outlines the steps to implement secure boot and firmware updates, including generating and verifying digital signatures.
  • The power consumption and thermal characteristics of the CY8C4127AXI-S455 are dependent on the operating frequency, voltage, and usage scenario. Infineon provides power consumption estimates and thermal characteristics in their datasheet and application notes, but actual values may vary. It's recommended to perform thermal and power analysis during the design and testing phase to ensure the device operates within the specified limits.
  • The CY8C4127AXI-S455 has a built-in CapSense feature that allows for capacitive touch sensing. Infineon provides a CapSense SDK and documentation that outlines the steps to implement CapSense, including sensor design, tuning, and calibration. However, the CapSense feature has limitations, such as sensitivity to noise, humidity, and proximity effects, which need to be considered during design and testing.
  • Infineon provides a range of development tools and software frameworks for the CY8C4127AXI-S455, including the PSoC Creator IDE, PSoC Programmer, and ModusToolbox. Additionally, there are third-party development tools and frameworks available, such as Keil µVision and IAR Embedded Workbench.

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CY8C4127AXI-S455 Overview

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