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CY8CMBR2016-24LQXI - Infineon

Description: CY8CMBR2016

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PCB Footprints
CY8CMBR2016-24LQXI - Infineon PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 48-Pin QFN-1
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3D Models
CY8CMBR2016-24LQXI - Infineon  - 3D model - Quad Flat No-Lead - 48-Pin QFN-1
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CY8CMBR2016-24LQXI Details

  • Manufacturer Part Number:

    CY8CMBR2016-24LQXI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-48

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • JESD-30 Code:

    S-XQCC-N48

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    PSoC

CY8CMBR2016-24LQXI Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN215306, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CY8CMBR2016-24LQXI has a built-in secure boot mechanism that can be used to ensure the authenticity and integrity of the firmware. Infineon provides a Secure Boot SDK and documentation that outlines the steps to implement secure boot and firmware updates, including cryptographic key management and digital signature verification.
  • The internal oscillator of the CY8CMBR2016-24LQXI has a typical accuracy of ±2% over the operating temperature range. To improve its accuracy, Infineon recommends using an external crystal oscillator or a high-accuracy clock source, such as a real-time clock (RTC) module. Additionally, the oscillator can be calibrated using the on-chip calibration mechanism.
  • To optimize power consumption, Infineon recommends using the device's low-power modes, such as Sleep and Hibernate, and configuring the peripherals and clock frequencies accordingly. Additionally, the use of a power management IC (PMIC) can help to reduce power consumption and extend battery life.
  • The CY8CMBR2016-24LQXI has a maximum junction temperature of 125°C. To ensure reliable operation, Infineon recommends following proper thermal management practices, such as using a heat sink, thermal interface material, and ensuring good airflow around the device. The device's thermal characteristics are outlined in the datasheet and thermal management application note.

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