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CYB06445LQI-S3D42 - Infineon

Description: Secure MCU 32bit ARM Cortex M4F/ARM Cortex M0+ RISC 512KB Flash 1.8V/2.5V/3.3V

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PCB Footprints
CYB06445LQI-S3D42 - Infineon PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 68 QFN 8 × 8 × 1 mm
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3D Models
CYB06445LQI-S3D42 - Infineon  - 3D model - Quad Flat No-Lead - 68 QFN 8 × 8 × 1 mm
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CYB06445LQI-S3D42 Details

  • Manufacturer Part Number:

    CYB06445LQI-S3D42

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-68

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • JESD-30 Code:

    S-XQCC-N68

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    68

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC68,.32SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.7 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    8 mm

  • uPs/uCs/Peripheral ICs Type:

    PROGRAMMABLE SoC

CYB06445LQI-S3D42 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout and thermal management guide in their application note AN2013-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal performance and thermal dissipation.
  • The CYB06445LQI-S3D42 has built-in overcurrent protection and fault detection features. Engineers can use the device's OC pin to detect overcurrent conditions and implement external circuitry to trigger a shutdown or alarm. Additionally, the device's FLT pin can be used to detect faults such as overvoltage, undervoltage, and overtemperature.
  • Infineon recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, placed as close as possible to the VIN pin of the device. This helps to reduce input voltage ripple and ensure stable operation.
  • To ensure EMC compliance, engineers should follow Infineon's guidelines for PCB layout, component selection, and shielding. Additionally, they should consider using EMI filters, ferrite beads, and shielding components to reduce electromagnetic radiation and susceptibility.
  • The CYB06445LQI-S3D42 has a controlled power-up and power-down sequence to prevent voltage overshoots and undershoots. During power-up, the device's output voltage ramps up slowly to prevent inrush currents. During power-down, the device's output voltage ramps down slowly to prevent voltage overshoots.

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CYB06445LQI-S3D42 Overview

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