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CYP15G0201DXB-BBXC - Infineon

Description: IC TXRX HOTLINK 196LBGA

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PCB Footprints
CYP15G0201DXB-BBXC - Infineon PCB footprint - BGA - BGA - 196-ball FBGA (15 × 15 × 1.5 mm)
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3D Models
CYP15G0201DXB-BBXC - Infineon  - 3D model - BGA - 196-ball FBGA (15 × 15 × 1.5 mm)
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CYP15G0201DXB-BBXC Details

  • Manufacturer Part Number:

    CYP15G0201DXB-BBXC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-196

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Data Rate:

    1500000 Mbps

  • JESD-30 Code:

    S-PBGA-B196

  • JESD-609 Code:

    e1

  • Length:

    15 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    196

  • Number of Transceivers:

    2

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA196,14X14,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.5 mm

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    15 mm

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CYP15G0201DXB-BBXC Overview

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