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CYT2BL3CAAQ0AZEGS - Infineon

Description: ARM Microcontrollers - MCU TRAVEO-2 BODY ENTRYLEVEL

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CYT2BL3CAAQ0AZEGS - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - 64-LQFP_2025
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CYT2BL3CAAQ0AZEGS - Infineon  - 3D model - Quad Flat Packages - 64-LQFP_2025
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CYT2BL3CAAQ0AZEGS Details

  • Manufacturer Part Number:

    CYT2BL3CAAQ0AZEGS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    17

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M4F

  • Clock Frequency-Max:

    80 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    140

  • Number of External Interrupts:

    49

  • Number of I/O Lines:

    45

  • Number of Serial I/Os:

    19

  • Number of Terminals:

    64

  • Number of Timers:

    3

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • RAM (bytes):

    524288

  • ROM (words):

    4259840

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    160 MHz

  • Supply Current-Max:

    127 mA

  • Supply Voltage-Max:

    1.15 V

  • Supply Voltage-Min:

    1.05 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

CYT2BL3CAAQ0AZEGS Frequently Asked Questions (FAQs)

  • Infineon provides a reference design guide for the CYT2BL3CAAQ0AZEGS, which includes recommendations for PCB layout, thermal management, and component placement. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and electromagnetic compatibility.
  • The CYT2BL3CAAQ0AZEGS has built-in overcurrent protection, but it's recommended to implement additional external fault detection and protection mechanisms, such as overcurrent sensing, overvoltage protection, and thermal monitoring. This can be achieved using external components and circuitry, or by using a dedicated fault detection IC.
  • The datasheet provides general guidelines for capacitor selection, but it's essential to consider the specific application requirements, such as voltage rating, capacitance value, and ESR. Infineon recommends using high-quality, low-ESR capacitors with a voltage rating that matches the input and output voltage ranges.
  • To ensure EMC and reduce EMI, follow Infineon's guidelines for PCB layout, component placement, and shielding. Additionally, use EMI filters, ferrite beads, and shielding components as necessary. It's also essential to perform EMC testing and certification according to relevant standards, such as IEC 61000-4-2 and CISPR 25.
  • For high-power applications, it's crucial to ensure effective thermal management to prevent overheating and reduce the risk of thermal shutdown. This can be achieved by using heat sinks, thermal interfaces, and forced air cooling. Infineon provides thermal models and simulation tools to help designers optimize their thermal management strategy.

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CYT2BL3CAAQ0AZEGS Overview

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