Part Image

CYT3DLABGBQ1AESGST - Infineon

Description: ARM® Cortex®-M0+, ARM® Cortex®-M7F Traveo™ T2G Microcontroller IC 32-Bit Dual-Core 240MHz 4.063MB (4.063M x 8) FLASH 216-TEQFP (24x24)

Download CYT3DLABGBQ1AESGST Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
CYT3DLABGBQ1AESGST - Infineon PCB footprint - Quad Flat Packages - Quad Flat Packages - PG-TQFP-216-800
click to zoom
3D Models
CYT3DLABGBQ1AESGST - Infineon  - 3D model - Quad Flat Packages - PG-TQFP-216-800
click to zoom

CYT3DLABGBQ1AESGST Details

  • Manufacturer Part Number:

    CYT3DLABGBQ1AESGST

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TEQFP-216

  • Country Of Origin:

    Singapore, Taiwan

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    17

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    CORTEX-M7

  • Clock Frequency-Max:

    33.34 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G218

  • Length:

    24 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    172

  • Number of External Interrupts:

    108

  • Number of I/O Lines:

    108

  • Number of Serial I/Os:

    15

  • Number of Terminals:

    218

  • Number of Timers:

    82

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP216,1.0SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TR

  • RAM (bytes):

    393216

  • ROM (words):

    4259840

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    240 MHz

  • Supply Current-Max:

    950 mA

  • Supply Voltage-Max:

    1.21 V

  • Supply Voltage-Min:

    1.09 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    24 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

CYT3DLABGBQ1AESGST Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for CYT3DLABGBQ1AESGST is -40°C to 125°C.
  • The clock frequency for CYT3DLABGBQ1AESGST can be configured using the Clock Control Register (CCR) and the Clock Divider Register (CDR). Refer to the datasheet for specific register settings and values.
  • The CYT3DLABGBQ1AESGST supports a maximum data transfer rate of up to 400 Mbps.
  • Secure boot can be implemented using the device's built-in ROM bootloader and Infineon's Secure Boot SDK. Refer to the datasheet and Infineon's documentation for detailed instructions.
  • The power consumption of CYT3DLABGBQ1AESGST varies depending on the operating mode. In active mode, the typical power consumption is around 150 mA, while in sleep mode it is around 10 μA. Refer to the datasheet for detailed power consumption specifications.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

CYT3DLABGBQ1AESGST Overview

Use the download button to access the CYT3DLABGBQ1AESGST schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CYT3D, or try a keyword search, such as Microcontrollers

Parts related to CYT3DLABGBQ1AESGST

Showing 0 results