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CYUSB3014-BZXCT - Infineon

Description: USB Interface IC FX3 Superspeed USB Controller

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PCB Footprints
CYUSB3014-BZXCT - Infineon PCB footprint - BGA - BGA - 121-ball BGA
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CYUSB3014-BZXCT - Infineon  - 3D model - BGA - 121-ball BGA
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CYUSB3014-BZXCT Details

  • Manufacturer Part Number:

    CYUSB3014-BZXCT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-121

  • ECCN Code:

    3A991.a.2

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    9.05

  • Address Bus Width:

    8

  • Bus Compatibility:

    I2C; I2S; SPI; UART

  • Clock Frequency-Max:

    52 MHz

  • Data Transfer Rate-Max:

    375 MBps

  • Drive Interface Standard:

    GPIF

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-PBGA-B121

  • JESD-609 Code:

    e1

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    121

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA121,11X11,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    200 mA

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    BUS CONTROLLER, UNIVERSAL SERIAL BUS

CYUSB3014-BZXCT Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-speed signals away from the power planes and use a 50-ohm impedance-controlled routing for the USB signals.
  • Use a metal shield around the device, keep the USB connector away from the PCB edge, and use a common-mode filter on the USB lines. Also, ensure that the PCB layout and component placement minimize radiation and susceptibility.
  • Power up the device in the following sequence: VBUS, VCC, and then VIO. Ensure that VBUS is stable before applying VCC and VIO. Also, ensure that the power supplies are ramped up slowly to prevent damage to the device.
  • Use a differential pair routing with a 90-ohm differential impedance and a 100-ohm single-ended impedance. Keep the signal traces short and use a common-mode filter to reduce electromagnetic interference (EMI).
  • Use a thermal pad on the bottom of the device and connect it to a solid ground plane. Ensure good airflow around the device and consider using a heat sink or thermal interface material to reduce the junction temperature.

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CYUSB3014-BZXCT Overview

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