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CYW20835PB1KML1GGF - Infineon

Description: IC RF TxRx + MCU Bluetooth Bluetooth v5.2, CDMA, EDGE, GSM, WCDMA 2.4GHz 60-VFQFN Exposed Pad

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PCB Footprints
CYW20835PB1KML1GGF - Infineon PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 7 mm × 7 mm 60-Pin QFN
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3D Models
CYW20835PB1KML1GGF - Infineon  - 3D model - Quad Flat No-Lead - 7 mm × 7 mm 60-Pin QFN
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CYW20835PB1KML1GGF Details

  • Manufacturer Part Number:

    CYW20835PB1KML1GGF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-60

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • JESD-30 Code:

    S-XQCC-N60

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    60

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC60,.27SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    1.625 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

CYW20835PB1KML1GGF Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN244101, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The CYW20835PB1KML1GGF has a built-in secure boot mechanism that ensures the authenticity and integrity of the firmware. Infineon provides a secure boot implementation guide and firmware update tools, such as the ModusToolbox, to help developers implement secure firmware updates and manage the device's lifecycle.
  • The power consumption of the CYW20835PB1KML1GGF varies depending on the operating mode and frequency. Infineon provides detailed power consumption and thermal characteristics in their datasheet and application notes, including thermal resistance and power dissipation data to help designers optimize their system design.
  • Infineon provides a range of application notes and guides that offer optimization techniques and best practices for specific use cases, such as Bluetooth Low Energy (BLE) performance optimization, coexistence with other wireless technologies, and power consumption reduction.
  • Infineon offers a range of development tools and SDKs, including the ModusToolbox, which provides a comprehensive development environment for the CYW20835PB1KML1GGF. The ModusToolbox includes a software development kit (SDK), a firmware development kit (FDK), and a range of tools and utilities for debugging, testing, and optimizing the device.

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CYW20835PB1KML1GGF Overview

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